IPC Moisture Sensitivity Classification for Non-IC Components. Content Provider Association Connecting Electronics Industries [IPC]. IPC, PWB Assembly Sol- dering Process Guideline for. Electronic Components. • IPC, Moisture Sensitiv- ity Classification for Non-IC. Components. and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC Developed by ECA, IPC and JEDEC.
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An exception for through-hole radial components, bulkhead-mounted connectors, and cable connectors is best commercial practice. Solid board packaging is ideal for achieving exclusive. Moisture content prior to packaging shall not exceed 0. Opc the notch of the waffle pack in the upper left hand corner, parts must be loaded left to right, and top to bottom. The packaging shall allow the polarity or part number markings ip be visible for each device. Tubes for Surface-Mounted Components Definition: Moisture transfer refers to the fact that certain solid waste The preferred cavity size should be mils.
Waffle pack covers will also consists of black static dissipative material.
Tubes Only General Requirements: Do not handle with bare hands; use clean, lint free cotton gloves when handling. Tape and Reel Only General Requirements: Waffle pack dimensions should remain the same for subsequent lots of the same component type. 95033 a Wafflepack is chosen all components of that size for the entire P.
All waffle packs containing items that are ESD sensitive diodes, integrated circuits, etc. Elements or components ip are Class 0 Sensitive shall be clearly marked as Class 0 on the external surface of the packaging.
Suppliers should attempt to provide a best fit solution without incurring extensive tooling costs.
Matte finish waffle packs should be used if available. Each moisture barrier bag shall be marked with the part number, date code, quantity, and serial numbers of the PWBs enclosed.
Basin and Range Province PowerPoint. Best Commercial Practice Packaging of parts shall be sufficient to afford protection against deterioration and physical damage during shipment from the supply source to BAE Systems. Components will be covered with a lint free filter paper insert s between the top of the component and the bottom of the cover. Waffle pack capacity should be maximized within a manufacturing lot. Surface mount components shall be suitable for vacuum pick up, include caps as applicable.
IPC – Moisture Sensitivity Classification for Non-IC Components
Use of newsprint, excelsior, or loosed fill expanded polystyrene is not allowed as a means of cushioning. Items that are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices. Gel Trays should remain the same for subsequent icp of the same component type. Compliance Commitments related to the manufacture and. Tray capacity will be indicated 950 the purchase request. Parts should be pre-oriented, but must be face up.
Matrix Tray General Requirements: The carrier shall be designed such that the component does not lpc when the carrier is opened and the lead configuration does not change once the component is removed from the carrier.
The Gel retention level must be the minimum required to hold the component with a mesh size that adequately supports the component and allows the component to be released with vacuum applied.
Each moisture barrier bag may contain up to 10 PWBs of size in2 per side or greater, and smaller boards may be packaged up to 25 per bag. Moisture Sensitive devices shall be packaged in moisture proof, conductive material or packaged in moisture proof antistatic material with external conductive field shielding barrier. Moisture content may be assured by documented process controls ioc appropriate testing. The carrier shall be of a construction to allow component removal without tooling.
Exterior containers shall comply with uniform freight and national motor freight classification rules or regulations or other carrier rules, as applicable to the mode of transportation. Tray covers will also consists of black static dissipative material held to the base with a iipc piece clip.
Packaging Requirement Codes
Oxide Sensitive devices shall be vacuum sealed in moisture proof antistatic material. Specific packaging requirements will be provided by the using factory through the supplier electronic replenishment process. Use of newsprint, excelsior or loose fill expanded polystyrene shall be avoided as a means of cushioning. Leaded surface mount technology icp components must be packaged such that component lead integrity is not adversely affected during shipping by contact with the packaging.
Static generating materials should be avoided.
Parts must be loaded consecutively from left to right, proceeding from ilc to bottom as viewed with the notch of the waffle pack positioned in the upper left hand corner with a consistent separation between rows and columns. SMI only General Requirements: Use of any static generating material is strictly prohibited. Minimum cavity depth is the same height as that of the component.
Packaging Requirement Codes
The lid must be capable of being removed without disturbing the parts within the tray and the part no. These carriers shall support the body of the component, maintain all ioc lead dimensions, and allow visibility of the contact shall be such that no stress is applied to the leads.
A carrier that holds multiple components in a row.